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October
6-9, 2008: ECA Fall Engineering Summit
click here to view other events in October 2008
2008 Fall Engineering Summit
Salt Lake City, UT
Our 2008 Fall Engineering Summit is a four-day program designed to inform and
connect leaders in the electronics components industry. NEW this year! A series
of exciting and relevant general sessions and participation activities. It's
your best chance to network with engineering leaders across the electronic components
industry as they consider, develop and finalize crucial EIA Standards. EIA Standards
sets the precedent for safety, interoperability and performance optimization
in an effective and efficient environment.
Don't miss this opportunity to:
• Contribute to your company's views on emerging standards
• Participate in streamlined standards development
• Promote new EIA Standards critical to your company's business
• Interface with industry experts on the issues that shape and define the
market
Be there to influence the technical course of the electronic components industry.
You can find out who is meeting and the cost to attend by viewing the program. Don't delay, register today!
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Schedule-at-a-Glance
For more details and registration information, please download
the summit brochure [551KB PDF]
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MONDAY • OCTOBER 6
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8:30 am – 4:00 pm
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Registration
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9:00 am – 5:00 pm
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CE-2.0 National Connector Standards
(part 1)
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9:00 am – Noon
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CeramicWorking Group
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Noon – 1:00 pm
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Box Lunch
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1:00 pm – 2:30 pm
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P-14 Overcurrent Protection Devices
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2:30 pm – 4:00 pm
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Tantalum Working Group
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5:00 pm – 8:00 pm
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Welcome Reception
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TUESDAY • OCTOBER 7
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7:30 am – 4:30 pm
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Registration
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8:00 am – Noon
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General Session 1 & 2
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8:00 am – 10:00 am
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(1) Competing in aWorld-wide Market
in the 21st Century
William Cutler, Bourns
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10:00 am – Noon
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(2) A Snapshot of New Findings on
Passive
Components in the 2009 iNEMI Roadmap
Robert C. Pfahl, Jr., iNEMI
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Noon – 1:30 pm
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Awards Luncheon
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1:30 pm – 4:30 pm
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CE-2.0 (part 2)
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1:30 pm – 4:30 pm
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S-1 General Session
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4:30 pm – 5:30 pm
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P-10 Integrated Passive Devices
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6:00 pm – 9:00 pm
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Reception/Dinner
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WEDNESDAY • OCTOBER 8
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7:30 am – Noon
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Registration
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8:00 am – 10:00 am
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General Session 3
Tape & Reel Packaging: Review of Changes to Industry Standards
Bill Aldeen, Nu-Way Electronics & Scott Carter, Tek-Pak
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10:00 am – 11:00 am
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P-1 Resistive Devices
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10:00 am – Noon
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Soldering Technology Committee (part
1)
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11:00 am – Noon
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P-2.2 Aluminum, Film and Mica Capacitors
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Noon – 1:30 pm
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Lunch (Working Lunch for P-2.1 Ceramic
Dielectric Capacitors)
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1:30 pm – 2:30 pm
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Soldering Technology Committee (part
2)
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1:30 pm – 2:30 pm
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P-3 Inductive Components
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2:30 pm – 3:30 pm
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P-2.5 Tantalum Capacitors
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3:30 pm – 5:30 pm
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P-4 Mechanical Outlines (part 1)
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5:30 pm – 6:30 pm
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Standards &Technology Policy
Council
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THURSDAY • OCTOBER 9
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8:00 am – Noon
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Automated Component Handling
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8:00 am – 10:00 am
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P-4 Mechanical Outlines (part 2, if needed)
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